Shared equipment
- Top
- Shared equipment
- Focused Ion Beams/Scanning Electron Microscope Dual-beam System(FIB/SEM)
Shared equipment
Focused Ion Beams/Scanning Electron Microscope Dual-beam System(FIB/SEM)
Focused Ion Beams/Scanning Electron Microscope Dual-beam System(FIB/SEM)
Helios NanoLabTM 600i
Equipment Overview (Purpose)
Nanoscale microfabrication, observation, analysis and sample preparation using Ga ion beams.
Main Features and Applications
【Features】
- Ultra-high resolution SEM observation
Possible to use as a dual-beam (FIB-SEM) system with sub-nanometer resolution. - High precision, high speed FIB processing
Equipped with the latest model of FIB, with the latest differential pumping system. The FIB column has excellent processing characteristics in all acceleration voltage ranges compared to conventional FIB columns, enabling the preparation of high-quality - Use of the latest software for automatic 3D analysis
Next generation 3D analysis made possible by the latest guidance analysis software.
【用途】
- TEMサンプル作製、サブミクロン実験用試料作製、断面観察、3D解析用イメージ取得
主な仕様
SEM | |
---|---|
Irradiation Voltage | 50V~30kV |
Imaging Resolution | 0.9nm@15kV、 1.4nm@1kV |
FIB | |
---|---|
Accelerating Voltage | 500V~30kV |
Imaging Resolution | 2.5nm@15kV |
Maximum Current Value | 65nA |
GIS | Pt、C |
Manipulator | Easy Lift |
Available Optional Features & Option Purpose
Available Optional Features | Option Purpose |
---|---|
Available Optional Features:Thermo Fisher Scientific Amira | Option Purpose:Visualize, process, and evaluate 3D data from computer tomography, microscopy results, MRI, etc. |
Available Optional Features:EDS(AMETEC EDAX-EDS SDD60mm2、TEAM) | Option Purpose:Identification and quantification of sample elements |
Available Optional Features:EBSD(AMETEC TSL-EBSD DigView、OIM) | Option Purpose:Orientation analysis of crystalline samples |
Available Optional Features:MAPS | Option Purpose:Automatic acquisition of high area images |
Available Optional Features:Auto Slice & View | Option Purpose:Automated cross-sectional slicing and SEM image acquisition software for 3D reconstruction applications |
Available Optional Features:EDS3 | Option Purpose:Automated cross-sectional slicing and EDS data acquisition software for 3D reconstruction applications |
Available Optional Features:EBSD3 | Option Purpose:EBSD3 Automated cross-sectional slicing and EBSD data acquisition software for 3D reconstruction applications |
Available Optional Features:CryoMAT | Option Purpose:Sample freezing by cooling stage |
Equipment Photo
- Tohoku University
- Institute for Materials Research, Tohoku University
- Institute of Fluid Science, Tohoku University
- Institute of Multidisciplinary Research for Advanced Materials, Tohoku University
- Research Institute of Electrical Communication, Tohoku University
- Head Office of Enterprise Partnerships, Tohoku University
- Core Facility Center
- Bulk Soft Magnetic Materials, Tohoku University
- Advanced Imaging and Modeling Center for Soft-materials
(Tohoku AIMcS)
2013 © Material Solutions Center, Tohoku University. All rights.